Pressure sensitive tape for forming water-tight field joints in

Details Pressure sensitive tape for forming water-tight field joints in Pressure sensitive tape for forming water-tight field joints in

1997-03-20

1998-03-31

Wilson, Donald R.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Sectional layer removable

428355AK, 428355BL, 428447, 428451, 524521, 524528, 525235, 525240, 525 90, C08L 2316, C08L 2322, C08L 2328, B32B 712

Patent

active

057336210

ABSTRACT:
An adhesive roofing tape is based on a combination of brominated butyl rubber and EPDM. A non-diene block terpolymer is interspersed in the cross-linked polymer network. A plasticizer and tackifier are included to provide resiliency and permanent tack. An important aspect of the invention is to use a high molecular weight polyisobutylene plasticizer and a peroxide curing system. Rapid crosslinking without concomitant rapid degradation of the brominated butyl rubber occurs and some limited degradation of the plasticizer contributes to surface tack. A method of making the adhesive roofing tape is also provided.

REFERENCES:
patent: 4588637 (1986-05-01), Chiu
patent: 4742119 (1988-05-01), Close
patent: 4785045 (1988-11-01), Yonekura et al.
patent: 4855172 (1989-08-01), Chiu
patent: 4897137 (1990-01-01), Miller et al.
patent: 5095068 (1992-03-01), Chiu
patent: 5234987 (1993-08-01), Hubbard et al.
patent: 5242727 (1993-09-01), Briddell et al.
patent: 5504136 (1996-04-01), Davis et al.
patent: 5613217 (1997-03-01), Davis et al.

Affiliated with

Also associated with

Rating

Pressure sensitive tape for forming water-tight field joints in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure sensitive tape for forming water-tight field joints in , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure sensitive tape for forming water-tight field joints in will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-49743