Pressure sensitive hot melt adhesive curable by exposure to elec

Details Pressure sensitive hot melt adhesive curable by exposure to elec Pressure sensitive hot melt adhesive curable by exposure to elec

1979-04-26

1980-11-18

Newsome, John H.

Stock material or miscellaneous articles

Composite

Of addition polymer from unsaturated monomers

20415914, 20415922, 427 44, 427 541, 526327, B05D 306

Patent

active

042346622

ABSTRACT:
Hot melt pressure sensitive adhesives are prepared by free-radical copolymerizing an acrylic-based comonomer(s) with allyl acrylate or methacrylate to produce a prepolymer with an ethylenically saturated backbone containing pendant allylic unsaturation which is then applied in fluid form to a substrate and thereafter subjected to electron beam curing.

REFERENCES:
patent: 2278637 (1942-04-01), Barnes
patent: 2456647 (1948-12-01), Rehberg et al.
patent: 2643991 (1953-06-01), Tawney
patent: 3219610 (1965-11-01), Tillson
patent: 4052527 (1977-10-01), Pastor et al.
patent: 4151055 (1979-04-01), Stueben et al.
patent: 4165266 (1979-08-01), Stueben et al.

Affiliated with

Also associated with

Rating

Pressure sensitive hot melt adhesive curable by exposure to elec does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure sensitive hot melt adhesive curable by exposure to elec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure sensitive hot melt adhesive curable by exposure to elec will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-598658