Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having a perfecting coating
Reexamination Certificate
2008-04-01
2008-04-01
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having a perfecting coating
Reexamination Certificate
active
07351645
ABSTRACT:
A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method for producing a semiconductor chip, in which the method involves the steps of: forming a groove having depth smaller than thickness of a wafer on a surface of the wafer on which a semiconductor circuit is formed; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer. The pressure sensitive adhesive sheet contains a rigid substrate, a vibration relaxation layer provided on one face of the rigid substrate and a pressure sensitive adhesive layer provided on the other face of the rigid substrate, in which thickness of the rigid substrate is 10 to 150 μm and Young's modulus thereof is 1000 to 30000 MPa, and thickness of the vibration relaxation layer is 5 to 80 μm and a maximum value of tan δ of dynamic viscoelasticity thereof at −5° C. to 120° C. is 0.5 or more.
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Izumi Tatsuya
Ohashi Hitoshi
Takahashi Kazuhiro
Le Thao P.
Lintec Corporation
The Webb Law Firm P.C.
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