Pressure-sensitive adhesive sheet for processing...

Details Pressure-sensitive adhesive sheet for processing... Pressure-sensitive adhesive sheet for processing...

2007-05-11

2010-06-01

Berman, Susan W (Department: 1796)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C522S117000, C522S121000, C428S343000, C428S345000, C428S3550AC

Reexamination Certificate

active

07727811

ABSTRACT:
The present invention relates to a pressure-sensitive adhesive sheet for processing a semiconductor wafer or semiconductor substrate, which includes a base material and a pressure-sensitive adhesive layer which is polymerizable and curable by an energy ray, the pressure-sensitive adhesive layer being disposed on a surface of the base material, in which the pressure-sensitive adhesive layer includes a base polymer, a multifunctional acrylate-based oligomer which has an energy-ray polymerizable carbon-carbon double bond and has a molecular weight of 1000 to 2500, and a multifunctional acrylate-based compound which has an energy-ray polymerizable carbon-carbon double bond and has a molecular weight of 200 to 700. The pressure-sensitive adhesive sheet of the invention is excellent in follow-up properties to a minute unevenness with a depth of about 0.4 to 40 μm such as a mark printed by laser irradiation, exhibits sufficient adhesive force, and can be released without the generation of adhesive residue after the purpose of adhesion has been achieved.

REFERENCES:
patent: 4756968 (1988-07-01), Ebe et al.
patent: 5955512 (1999-09-01), Numazawa et al.
patent: 6461728 (2002-10-01), Weiss et al.
patent: 6472065 (2002-10-01), Alahapperuma et al.
patent: 6759121 (2004-07-01), Alahapperuma et al.
patent: 2005/0048241 (2005-03-01), Terada et al.
patent: 0 344 529 (1989-12-01), None
patent: 0 745 654 (1996-12-01), None
patent: 2 312 429 (1997-10-01), None
patent: 62-153376 (1987-07-01), None
patent: 6-49420 (1994-02-01), None

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