Pressure-sensitive adhesive sheet and process for producing...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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Details

C438S017000, C257SE21531, C257SE23092, C257SE23107

Reexamination Certificate

active

08048690

ABSTRACT:
A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

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