Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-10-09
2011-11-01
Lebentritt, Michael (Department: 2829)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S017000, C257SE21531, C257SE23092, C257SE23107
Reexamination Certificate
active
08048690
ABSTRACT:
A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.
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Asai Fumiteru
Hashimoto Hirokuni
Terada Yoshio
Knobbe Martens Olson & Bear LLP
Lebentritt Michael
Nitto Denko Corporation
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