Pressure-sensitive adhesive for temporarily securing electronic

Details Pressure-sensitive adhesive for temporarily securing electronic Pressure-sensitive adhesive for temporarily securing electronic

1990-09-05

1992-02-04

Heinrich, Samuel M.

Metal fusion bonding

Process

With supplementary mechanical joining

2281802, 228176, 156281, H05K 334, H01L 2158, B23K 100

Patent

active

050853643

ABSTRACT:
A pressure-sensitive adhesive for use in temporarily securing electronic devices, particularly surface-mounting devices onto a printed circuit board in position during soldering, thereby preventing the devices from dropping from the board. The pressure-sensitive adhesive consists essentially of a resinous material having a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.9 dyne/cm.sup.2 as measured at the soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz. Preferably, the resinous material has a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.7 dyne/cm.sup.2 and a value for tan .delta. of greater than 0.2 as measured under the above conditions. In this case, the pressure-sensitive adhesive exhibits a self-aligning effect whereby electronic devices mounted out of position on the board are forced to move toward the proper positions by the action of the surface tension of a molten solder.

REFERENCES:
patent: 4749120 (1988-06-01), Hatada
patent: 4851966 (1989-07-01), Roback et al.
patent: 4979663 (1990-12-01), Sofia et al.
patent: 5012969 (1991-05-01), Hatada et al.

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