Pressure-sensitive adhesive for temporarily securing electronic

Details Pressure-sensitive adhesive for temporarily securing electronic Pressure-sensitive adhesive for temporarily securing electronic

1991-11-08

1994-08-02

Davis, Jenna L.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Halogen containing compound

428 42, 428355, C09J 702

Patent

active

053344308

ABSTRACT:
A pressure-sensitive adhesive for use in temporarily securing electronic devices, particularly surface-mounting devices onto a printed circuit board in position during soldering, thereby preventing the devices from dropping from the board. The pressure-sensitive adhesive consists essentially of a resinous material having a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.9 dyne/cm.sup.2 as measured at the soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz. Preferably, the resinous material has a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.7 dyne/cm.sup.2 and a value for tan .delta. of greater than 0.2 as measured under the above conditions. In this case, the pressure-sensitive adhesive exhibits a self-aligning effect whereby electronic devices mounted out of position on the board are forced to move toward the proper positions by the action of the surface tension of a molten solder.

REFERENCES:
patent: 2857356 (1958-10-01), Goodwin
patent: 3032438 (1962-05-01), Gaynes
patent: 3202535 (1965-08-01), Gaynes
patent: 3527842 (1970-09-01), Clark
patent: 3617362 (1971-11-01), Bemmells
patent: 4004061 (1977-01-01), Creighton
patent: 4016328 (1977-04-01), Horning
patent: 4039707 (1977-08-01), O'Malley
patent: 4642321 (1987-02-01), Schoenberg
patent: 4693920 (1987-09-01), Agarwal
patent: 4695508 (1987-09-01), Kageyama

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