Stock material or miscellaneous articles – Composite – Of addition polymer from unsaturated monomers
Reexamination Certificate
2007-04-10
2007-04-10
Mullis, Jeffrey (Department: 1711)
Stock material or miscellaneous articles
Composite
Of addition polymer from unsaturated monomers
C525S192000, C525S193000, C525S194000, C525S195000, C525S196000
Reexamination Certificate
active
10507245
ABSTRACT:
A surface protecting adhesive film for a semiconductor wafer in which an adhesive layer is formed on one surface of a base film, wherein the adhesive layer comprises 100 weight parts of a polymer (A) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from −50° C. to 5° C. at which tan δ of a dynamic viscoelasticity is maximized, from 10 weight parts to 100 weight parts of a polymer (B) having a functional group capable of reacting with a cross-linking agent and a temperature in a range of from more than 5° C. to 50° C. at which tan δ of a dynamic viscoelasticity is maximized, and from 0.1 weight part to 10 weight parts of a cross-linking agent (C) having more than 2 cross-linking reactive functional groups in a molecule based on 100 weight parts of total amount of the polymers (A) and (B), and the surface protecting adhesive film for a semiconductor wafer which the thickness of the adhesive layer is from 5 μm to 50 μm has an excellent adhesion, prevention of breakage and contamination resistance.
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English translation of JP 9-255933 published Sep. 30, 1997*.
English translation of JP 2001-199932 published Jul. 24, 2001*.
English tranlation of JP 2001-72951 publishedd Mar. 21, 2001*.
Fujii Yasuhisa
Hayakawa Shin-ichi
Kataoka Makoto
Miyakawa Masafumi
Nakashima Jun
Buchanan & Ingersoll & Rooney PC
Mitsui Chemicals Inc.
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