Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate
2007-07-03
2007-07-03
Hu, Shouxiang (Department: 2811)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
C438S459000, C257S642000
Reexamination Certificate
active
10506806
ABSTRACT:
The present invention relates to a surface protecting adhesive film for a semiconductor wafer in which an adhesive layer having a storage elastic modulus from 1×105Pa to 1×107Pa at 150° C. and a thickness of from 3 μm to 100 μm is formed on both a surface and back surface of a base film having a melting point of at least 200° C. and a thickness of 10 μm to 200 μm. According to the present invention, in a step of grinding the back side of a semiconductor wafer and removing a damaged layer generated on the back side, the semiconductor wafer can be prevented from being broken and being contaminated and the like even if a semiconductor wafer is thinned as low as 100 μm.
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English translation of JP 2002-053819 published Feb. 19, 2002.
English translation of JP 10-242086 published Sep. 11, 1998.
Hayakawa Shin-ichi
Igarashi Kouji
Kataoka Makoto
Miyakawa Masafumi
Saimoto Yoshihisa
Hu Shouxiang
Mitsui Chemicals Inc.
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