Pressure sensitive adhesive double coated sheet and method...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

Reexamination Certificate

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Details

C428S345000, C428S343000, C428S3550AC

Reexamination Certificate

active

07105226

ABSTRACT:
Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120° C. of 5×105Pa or less.The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warp and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration. Further, the invention provides a process of producing semiconductors of high reliability in which the above pressure sensitive adhesive double coated sheet is used.

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