Pressure retaining enclosure

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156 86, 174DIG8, 174 92, B29C 2700, B32B 3104

Patent

active

046145575

ABSTRACT:
An enclosure (1) around a substrate (3) such as a telecommunications cable is made pressure retaining by the provision of re-entrant seals (5), generally V-shaped in cross-section, that are positioned at the region where the enclosure is bonded (4) to the substrate pressure within the enclosure thus tends to open the V rather than put the bond in peel. The re-entrant seals may be cut-to-length in the field and a leak path through the resulting open end (23) avoided by using pressure (P) within the enclosure to close the open end or to balance pressure across it.

REFERENCES:
patent: 4135587 (1979-01-01), Diaz
patent: 4466846 (1984-08-01), Nolf et al.

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