Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1985-01-08
1986-09-30
Kittle, John E.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 86, 174DIG8, 174 92, B29C 2700, B32B 3104
Patent
active
046145575
ABSTRACT:
An enclosure (1) around a substrate (3) such as a telecommunications cable is made pressure retaining by the provision of re-entrant seals (5), generally V-shaped in cross-section, that are positioned at the region where the enclosure is bonded (4) to the substrate pressure within the enclosure thus tends to open the V rather than put the bond in peel. The re-entrant seals may be cut-to-length in the field and a leak path through the resulting open end (23) avoided by using pressure (P) within the enclosure to close the open end or to balance pressure across it.
REFERENCES:
patent: 4135587 (1979-01-01), Diaz
patent: 4466846 (1984-08-01), Nolf et al.
Van Emelen Rik
Verhoeven Rik
Wille Marc
Blecker Ira David
Kittle John E.
Raychem Corporation
Seidleck James J.
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