Pressure-punch device for film welding

Details Pressure-punch device for film welding Pressure-punch device for film welding

2007-10-23

2007-10-23

Pelham, J. (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S243000, C219S254000, C219S259000, C219S544000, C264S319000, C264S320000, C156S583100, C053S375900

Reexamination Certificate

active

10538247

ABSTRACT:
In a pressure stamp device for the sealing of films with a slidable stamp element with a stamping surface for applying pressure to a first foil to bond it to a supported second foil, a substantially homogeneous internal temperature distribution is reached by contributing the stamping element with multiple layers so that it includes basically three layers with a heated central layer of a first material with a thermal conductivity and two peripheral layers of a second material flanking it, the surface being formed by one of the peripheral layers to constitute the stamping surface.

REFERENCES:
patent: 2574095 (1951-11-01), Langer
patent: 3015601 (1962-01-01), Fener
patent: 3085144 (1963-04-01), Bate
patent: 3916148 (1975-10-01), LaFleur
patent: 4353855 (1982-10-01), Garabedian
patent: 4612081 (1986-09-01), Kasper et al.
patent: 2005/0082698 (2005-04-01), Gutman et al.
patent: 1 956 717 (1971-05-01), None
patent: 2 033 831 (1980-05-01), None
patent: 2 289 237 (1995-11-01), None
patent: WO 02/37897 (2002-05-01), None

Affiliated with

Also associated with

Rating

Pressure-punch device for film welding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure-punch device for film welding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure-punch device for film welding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3867454