Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1997-06-04
1998-06-16
Nguyen, Khanh P.
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
26427217, 264275, 264279, 425116, 425117, B29C 4514
Patent
active
057665354
ABSTRACT:
A mold system for encapsulating substrate-mounted ICs includes a split mold having a lower cavity adapted for positioning the substrate and an upper cavity adapted for providing a volume space around the IC. The lower cavity is provided with a compressible shim plate adapted to lie on a bottom surface of the lower cavity such that a substrate of a substrate-mounted IC placed in the lower cavity will extend above the upper limit of the lower cavity, which is the split surface of the mold. As the split mold is closed, a lower surface of the upper mold portion encounters first an upper surface of the substrate, then the compressible shim plate is compressed until the mold is fully closed, at which time the lower surface of the upper mold portion is in intimate contact with both the substrate and the upper surface of the lower mold portion. The IC mounted on the substrate is then presented in the upper cavity for encapsulation. This apparatus and method allows a lower mold portion having a single cavity depth to be used to encapsulate substrate-mounted ICs wherein the substrate thickness may vary from part-to-part.
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Boys Donald R.
Integrated Packaging Assembly Corporation
Nguyen Khanh P.
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