Pressure piece for use in a power semiconductor module

Details Pressure piece for use in a power semiconductor module Pressure piece for use in a power semiconductor module

2005-12-27

2005-12-27

Gushi, Ross (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

06979204

ABSTRACT:
A pressure piece for a compact power semiconductor module for direct mounting on a heat sink. The power semiconductor module has resilient connection leads for electrical connection to a printed circuit board disposed outside the housing. The pressure piece is dimensionally stable and effects pressure-contact between the printed circuit board and the connection leads. On its primary face facing the printed circuit board, the pressure piece has a plurality of pressure elements that space the primary face from the printed circuit board. In a preferred embodiment at least one rib includes a notch. Preferably, the pressure piece has at least one opening connecting its two primary faces permitting fluid flow between the edge of the pressure element and the notch.

REFERENCES:
patent: 5409419 (1995-04-01), Euchner et al.
patent: 5653397 (1997-08-01), Park
patent: 5793618 (1998-08-01), Chan et al.
patent: 6454587 (2002-09-01), Malone
patent: 196 30 173 (1998-01-01), None
patent: 198 47 029 (2000-04-01), None
patent: 199 03 875 (2000-08-01), None

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