Pressure-mounted semiconductive structure

Electricity: conductors and insulators – Feedthrough or bushing – Compression

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357 55, 357 76, 357 79, 357 81, 174 15, H01L 2504, H01L 2332, H01L 2342

Patent

active

041268830

ABSTRACT:
A semiconductive structure comprised of a semiconductive element, feed electrodes and other related components thereof, each provided with an aperture aligned with the aperture of the other elements and a single clamping bolt means positioned through the aperture of each component to align the components relative to one another and to exert pressure on the semiconductive component.

REFERENCES:
patent: 2826725 (1958-03-01), Roberts
patent: 2852723 (1958-09-01), Escoffery
patent: 3457474 (1969-07-01), Weisshaar et al.
patent: 3475660 (1969-10-01), Coblenz
patent: 3532942 (1970-10-01), Boyer
patent: 3643131 (1972-02-01), Scherbaum
patent: 3646407 (1972-02-01), Meuleman
patent: 3652903 (1972-03-01), Eriksson et al.
patent: 3925802 (1975-12-01), Watanabe

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