Measuring and testing – Fluid pressure gauge – Diaphragm
Reexamination Certificate
2006-06-27
2006-06-27
Lefkowitz, Edward (Department: 2855)
Measuring and testing
Fluid pressure gauge
Diaphragm
Reexamination Certificate
active
07066030
ABSTRACT:
Process for contacting diaphragm electrode (6) for pressure-measuring configuration. Connection of diaphragm (3) on which diaphragm electrode (6) is positioned to base (1) by connecting element (2) made of electrically insulating material running between the two. Base exhibits throughplating hole (7, 10) between attachment point (8) and connecting point (9) for electrically insulating material, and connecting element (2) exhibits connecting element throughplating (11) between connecting point (9) and diaphragm or diaphragm electrode. Conductive contact material (13) is provided in throughplating hole (7, 10). Contact material (13) is activated by heating. Throughplating (11) is prepared through connecting element (2) without forming opening that weakens material and without needing to align diaphragm, connecting element, and base with respect to throughplating holes. Contact material (13) is a material from which ions penetrate insulating material upon heating and render insulating material conductive to form connecting element throughplating (11).
REFERENCES:
patent: 3952234 (1976-04-01), Birchall
patent: 4839700 (1989-06-01), Ramesham et al.
patent: 5544399 (1996-08-01), Bishop et al.
patent: 5561247 (1996-10-01), Mutoh et al.
patent: 5836063 (1998-11-01), Hegner et al.
patent: 5983727 (1999-11-01), Wellman et al.
patent: 6184096 (2001-02-01), Lee et al.
patent: 6267009 (2001-07-01), Drewes et al.
patent: 6488199 (2002-12-01), Schwaiger et al.
patent: 6536287 (2003-03-01), Beekhuizen et al.
patent: 6578427 (2003-06-01), Hegner
patent: 2004/0104114 (2004-06-01), Schulte et al.
patent: 2004/0206829 (2004-10-01), Welling et al.
patent: 42 31 120 (1994-03-01), None
patent: 4231120 (1994-03-01), None
patent: 100 52 053 (2002-04-01), None
patent: WO 02/33372 (2002-04-01), None
Arroyo Teresa M.
Bonanto George P
Kang Gregory B.
Lefkowitz Edward
Nath & Associates PLLC
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