Pressure interconnect package for integrated circuits

Details Pressure interconnect package for integrated circuits Pressure interconnect package for integrated circuits

1984-03-19

1986-07-01

Abrams, Neil

Geometrical instruments

339174, 361398, H01R 2372

Patent

active

045976171

ABSTRACT:
A pressure interconnect package for connecting an integrated circuit chip to an etched circuit board comprising a pressurized stack of circuit elements in which a flexible interconnecting circuit is disposed between the IC chip and the etched circuit board to cause them to make electrical contact upon the application of pressure to the stack.

REFERENCES:
patent: 1663570 (1928-03-01), Senz
patent: 3825801 (1974-07-01), Beavitt et al.
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3967162 (1976-06-01), Ceresa et al.
patent: 3991463 (1976-11-01), Squitieri et al.
patent: 4169642 (1979-10-01), Mouissie
patent: 4360858 (1982-11-01), Fahling
patent: 4390220 (1983-07-01), Benasutti

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