Pressure differential downset apparatus

Metal deforming – With means to drive tool – Including pneumatic- or fluid-actuated tool support

Patent

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Details

29740, 29827, 7245301, 724531, B21J 918

Patent

active

054818990

ABSTRACT:
The edges of a semiconductor die are moved away from the lead frame leads attached to the die by using a pressure differential across the semiconductor die.

REFERENCES:
patent: 4835847 (1989-06-01), Kamperman

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