Pressure contract spring for contact arrangement in power...

Details Pressure contract spring for contact arrangement in power... Pressure contract spring for contact arrangement in power...

2007-09-04

2007-09-04

Ta, Tho D. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S591000, C439S700000, C439S824000

Reexamination Certificate

active

10567787

ABSTRACT:
The pressure contact spring (3) according to the invention comprises two contacting regions (31, 32) for contacting metallized contact pads (1, 2), one contacting region comprising a contact tip (31). Arranged between the contacting regions is a compressing region (33). The contact tip is rounded with an outer radius.The rounded contact tip penetrates only little into the metallization of the contact pad even under high spring force.

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C. Göbl et al., SKiiP 3SEMIKRON Elektronik GmbH, (www.semikron.com/jahr2000/pcimskiip3.pdf-downloaded), Aug. 11, 2002, pp. 1-6.

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