Pressure-contact type semiconductor device

Details Pressure-contact type semiconductor device Pressure-contact type semiconductor device

1991-10-09

1993-08-03

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361408, 361776, 257688, 174260, H05K 702

Patent

active

052335038

ABSTRACT:
A pressure-contact type semiconductor device with pressure-contact electrodes for external connection is disclosed. The pressure-contact electrodes are mounted through an insulating material on a metal substrate having semiconductor elements mounted thereon side-by-side. The pressure-contact electrodes are wire-bonded to the terminals of the semiconductor elements. Flexible insulating sheets are inserted between the metal substrate and the pressure-contact electrode and between the pressure-contact electrodes respectively. The insulating sheets are fixed onto the metal substrate and the pressure-contact electrodes through an adhesive.

REFERENCES:
patent: 4489364 (1984-12-01), Chance et al.
patent: 4546413 (1985-10-01), Feinberg et al.

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