Pressure contact semiconductor device

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361389, 174 52FP, 174525, 357 76, 357 79, H01L 2332, H01L 2340

Patent

active

047759160

ABSTRACT:
A pressure contact semiconductor device has a semiconductor substrate disposed on a metal post electrode through metal electrode plate, an insulating ring engaged with the periphery of the metal post electrode extends to the periphery of the metal electrode plate and is brought into contact therewith at a certain height with a sufficient contact pressure. The semiconductor substrate is positioned precisely with respect to the metal post electrode so that a gate electrode ring is precisely positioned on a gate electrode film formed on the upper surface of the semiconductor substrate.

REFERENCES:
patent: 3890637 (1975-06-01), Yamamoto
patent: 4099201 (1978-07-01), Mueller
patent: 4188637 (1980-02-01), Gerstenkoper et al.
patent: 4587550 (1986-05-01), Matsuda
patent: 4646130 (1987-02-01), Creutz

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Pressure contact semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure contact semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure contact semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2158882

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.