Pressure contact semiconductor device

Details Pressure contact semiconductor device Pressure contact semiconductor device

1987-07-20

1988-12-20

Sikes, William L.

357 74, H01L 2342, H01L 2302

Patent

active

047928441

ABSTRACT:
A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support member; a cylindrical body for containing the semiconductor element and the elastic body, the lower end of the cylindrical body being fixed to the support member; and a plurality of curved projections produced so as to be in contact with the upper end of the elastic body by curving at least three points of the top end of the cylindrical body while pressure is applied to the semiconductor element through the elastic body.

REFERENCES:
patent: 3683342 (1972-08-01), Meyerhoff et al.
patent: 3950778 (1976-04-01), Pomper et al.

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