Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-02-16
1998-05-19
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
29832, 257727, 361719, H05K 720
Patent
active
057544018
ABSTRACT:
A heatsink is pressure compliantly mounted against a substrate-mounted packaged electronic device such that the heatsink is not readily dislodged from the device package. A layer of pressure-compliant elastomeric foam material is sandwiched between the upper surface of the heatsink and an overlying shroud, which biases the heatsink downward toward the packaged device, which may be a BGA-packaged device. The lower heatsink surface is attached to the upper device package surface with double-sided thermal tape, and the shroud is attached to the substrate and compressively but compliantly urges each heatsink into more intimate thermal contact with an underlying device. The pressure-compliant material compensates for dimensional vertical tolerances associated with the substrate-mounted devices and heatsinks, while dampening vibrations and minimizing stress and torque that could otherwise damage the devices and/or the integrity of their electrical connections to the substrate.
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Kim David K. J.
Saneinejad Mohsen
Waters Mark H.
Sun Microsystems Inc.
Tolin Gerald P.
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