Pressure bonding and densification process for manufacturing low

Metal fusion bonding – Process – Plural joints

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228205, 228221, 2282351, B23K 2002, B23K 20233

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active

060859652

ABSTRACT:
A novel method of forming low density core metal parts by pressure bonding face sheets to a porous foam metal core and simultaneously densifying the core is disclosed. In particular, low density core aluminum and aluminum alloy parts can be formed according to the method of the invention. The method of forming low density core metal parts generally comprises the steps of providing a porous, foam metal core and simultaneously pressure bonding first and second solid metal face sheets directly to opposite sides of the core and densifying the core by applying heat and uniaxial forge pressure to the first and second face sheets and to the core for a predetermined period of time. The method of the invention can therefore produce LDC parts having a predetermined shape and density. Furthermore, the LDC parts are less subject to interfacial oxidation and delamination than conventional LDC parts made by brazing.

REFERENCES:
patent: 3609855 (1971-10-01), Schmidt
patent: 3703763 (1972-11-01), Berry
patent: 3834881 (1974-09-01), Niebylski
patent: 3873392 (1975-03-01), Niebylski et al.
patent: 4087037 (1978-05-01), Schier et al.
patent: 4252263 (1981-02-01), Houston
patent: 4315591 (1982-02-01), Houston
patent: 4907736 (1990-03-01), Doble
patent: 5024368 (1991-06-01), Bottomley et al.
patent: 5174143 (1992-12-01), Martin
patent: 5253796 (1993-10-01), Stacher et al.
patent: 5482533 (1996-01-01), Masuda et al.
patent: 5564064 (1996-10-01), Martin
V.N. Chudin et al., Technology of combined deformation and diffusion bonding laminated, load-bearing constructions, Welding International (no month) 1996, 10 (3) 224-227.
High-Temperature Solid-State Welding, W. Lehrheuer, ASM Handbook, vol. 6, Welding, Brazing, and Soldering, Dec. 1993.

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