Pressure assembled motor cube

Details Pressure assembled motor cube Pressure assembled motor cube

1997-12-05

2000-06-27

Guay, John

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

By pressure alone

257688, 257689, 257687, 257706, 257724, 257725, 257726, 257727, 257698, 257177, 257178, 257181, 257182, 361707, 361728, 361820, H01L 2352

Patent

active

060810394

ABSTRACT:
A pressure assembled power module is provided with first and second die, the first and second die being stacked atop one another and sandwiched between first and second conductive sheets, where the die are separated by a relatively flat central conductive lead. Integral to the central conductive lead are spring elements which bias the die against both the conductive sheets and the central conductive lead. Consequently, electrical and thermal interconnections are achieved between semiconductor devices and between the semiconductor devices and a heat sink or substrate.

REFERENCES:
patent: 2780758 (1957-02-01), Zetwo
patent: 2936409 (1960-05-01), Jackson et al.
patent: 3452254 (1969-06-01), Boyer
patent: 3506889 (1970-04-01), Vogt
patent: 3525910 (1970-08-01), Philips
patent: 4443655 (1984-04-01), Van Dyk Soerewyn
patent: 5489802 (1996-02-01), Sakamoto et al.
patent: 5677567 (1997-10-01), Ma et al.
patent: 5739556 (1998-04-01), Bolgiani

Affiliated with

Also associated with

Rating

Pressure assembled motor cube does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pressure assembled motor cube, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pressure assembled motor cube will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1786782