Envelopes – wrappers – and paperboard boxes – Wrapper – Bottle
Patent
1995-06-29
1997-05-27
Bradley, P. Austin
Envelopes, wrappers, and paperboard boxes
Wrapper
Bottle
228 443, 228 495, 2282351, 1565831, B23K 3704
Patent
active
056324340
ABSTRACT:
A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto.
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"Vacuum Bond Fixture," IBM Tech. Discl. Bull., vol. 35, No. 3 (Aug. 1992) p. 444.
Evans Leland B.
Malba Vincent
Bradley P. Austin
Carnahan L. E.
Knapp Jeffrey T.
Regents of the University of California
Sartorio Henry P.
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