Press pack power semiconductor device incorporating a plurality

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – With housing or external electrode

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257688, 257689, 257723, H01L 2348

Patent

active

057264660

ABSTRACT:
A press pack power semiconductor device incorporates a number of semiconductor elements. The power semiconductor device has a first insulating frame surrounding each of the semiconductor elements and having a lattice for positioning the semiconductor elements. First and second hard metal electrode plates are provided on the respective sides of each semiconductor element. A first electrode member is in contact with the first hard metal electrode plate. A second insulating frame, having a lattice for positioning the second hard metal electrode plate, is laid on the first insulating frame. A second electrode member is provided. This second electrode member has a lattice-shaped groove in which a lattice-shaped frame portion of the second insulating frame is fitted for positioning.

REFERENCES:
patent: 5610439 (1997-03-01), Hiyoshi et al.

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