Press-contact type semiconductor device

Details Press-contact type semiconductor device Press-contact type semiconductor device

1988-03-25

1990-04-17

Hille, Rolf

357 71, 357 74, 357 81, 357 56, H01L 2342, H01L 2344, H01L 2346

Patent

active

049185144

ABSTRACT:
A soft metal plate having substantially equal hardness as emitter electrodes formed of soft metal is disposed between the emitter electrodes and a heat buffer metal plate formed of hard metal, and pressure applied to the emitter electrodes is shared by the soft metal plate, so as to reduce the thermal fatigue of the emitter electrodes.

REFERENCES:
patent: 4246596 (1981-01-01), Iwasaki
patent: 4618877 (1986-10-01), Araki et al.
patent: 4724475 (1988-02-01), Matsuda

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