Prepreg process for producing the same and printed circuit subst

Details Prepreg process for producing the same and printed circuit subst Prepreg process for producing the same and printed circuit subst

1998-06-23

2000-03-07

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4282974, 4283066, 428361, 428378, 428395, 428396, 428408, 428458, 4284744, 428901, 428910, 174258, 361750, B23B 300

Patent

active

060337656

ABSTRACT:
The present invention provides a printed circuit substrate comprising a lightweight prepreg and a conductive layer. The prepeg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.

REFERENCES:
patent: 3530087 (1970-09-01), Hayes et al.
patent: 4775583 (1988-10-01), Kawamura
patent: 5002637 (1991-03-01), Toyoshima et al.
patent: 5314742 (1994-05-01), Kirayoglu et al.

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