Prepreg, process for producing the same and printed circuit subs

Details Prepreg, process for producing the same and printed circuit subs Prepreg, process for producing the same and printed circuit subs

1996-10-15

1998-12-22

Lam, Cathy F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Noninterengaged fiber-containing paper-free web or sheet...

428361, 428378, 428395, 428408, 428457, 4284744, 428902, 428910, 4282987, 4283044, 442 60, 442168, 442169, 174256, 361750, B32B 528, B32B 526, B32B 1704

Patent

active

058516468

ABSTRACT:
The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.

REFERENCES:
patent: 3530087 (1970-09-01), Hayes et al.
patent: 4775583 (1988-10-01), Kawamura
patent: 5002637 (1991-03-01), Toyoshima et al.
patent: 5314742 (1994-05-01), Kirayoglu et al.
Chemical Abstracts, Abstract of JP-A 5-327148.

Affiliated with

Also associated with

Rating

Prepreg, process for producing the same and printed circuit subs does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Prepreg, process for producing the same and printed circuit subs, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Prepreg, process for producing the same and printed circuit subs will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2044335