Prepreg for printed wiring board, metal foil clad laminate...

Details Prepreg for printed wiring board, metal foil clad laminate... Prepreg for printed wiring board, metal foil clad laminate...

2011-05-24

2011-05-24

Lam, Cathy (Department: 1784)

Coating processes

Applying superposed diverse coating or coating a coated base

C427S369000, C427S370000, C427S407300, C029S829000

Reexamination Certificate

active

07947332

ABSTRACT:
A printed wiring board prepreg according to the present invention is a printed wiring board prepreg obtained by impregnation-drying of a base material with a thermosetting resin composition, and when it is bent by 90°, cracks do not occur in the base material.

REFERENCES:
patent: 4191800 (1980-03-01), Holtzman
patent: 4353954 (1982-10-01), Yamaoka et al.
patent: 4997702 (1991-03-01), Gazit et al.
patent: 5885723 (1999-03-01), Takahashi et al.
patent: 6274225 (2001-08-01), Miyake et al.
patent: 6479615 (2002-11-01), Fukuoka et al.
patent: 6572968 (2003-06-01), Takano et al.
patent: 6605353 (2003-08-01), Okada et al.
patent: 6696155 (2004-02-01), Takano et al.
patent: 6713143 (2004-03-01), Hashimoto et al.
patent: 6736988 (2004-05-01), Gaku et al.
patent: 7037586 (2006-05-01), Yokota et al.
patent: 7118798 (2006-10-01), Goda et al.
patent: 7138174 (2006-11-01), Takeuchi et al.
patent: 7179519 (2007-02-01), Nishinaka et al.
patent: 7384683 (2008-06-01), Echigo et al.
patent: 2002/0106521 (2002-08-01), Hashimoto et al.
patent: 1439038 (2003-08-01), None
patent: 1264804 (2002-12-01), None
patent: 1300444 (2003-04-01), None
patent: 2137425 (1984-10-01), None
patent: 49-25499 (1974-03-01), None
patent: 61-211006 (1986-09-01), None
patent: 62-80369 (1987-05-01), None
patent: 63-158217 (1988-07-01), None
patent: 01-245586 (1989-09-01), None
patent: 5-347461 (1993-12-01), None
patent: 6-45364 (1994-06-01), None
patent: 07-045959 (1995-02-01), None
patent: 8-250860 (1996-09-01), None
patent: 10-200258 (1998-07-01), None
patent: 2001-294675 (2001-10-01), None
patent: 2002-080693 (2002-03-01), None
patent: 2002-121303 (2002-04-01), None
patent: 2002-226680 (2002-08-01), None
patent: 2002-292663 (2002-10-01), None
patent: 2003-198132 (2003-07-01), None
patent: 2004-025835 (2004-01-01), None
patent: 2001-0051460 (2001-06-01), None
patent: 2003-0034106 (2003-01-01), None
patent: WO 02/00791 (2002-01-01), None
Translation of the Preliminary Report on Patentability, for Application No. PCT/JP2005/011449, mailed Jan. 11, 2007.
Supplementary European Search Report for Application No. EP 05 76 5134, dated Jul. 11, 2007.
Korean Official Action dated Aug. 18, 2008, for Application No. 10-2008-7014435.
Korean Official Action dated Oct. 9, 2009, for Application No. 10-2009-7014942.
Korean Official Action dated Nov. 27, 2009, for Application No. 10-2007-7001494.
Chinese Official Action issued May 8, 2009, for Application No. 200580019300.3.
Korean Official Action issued on Aug. 11, 2009, for Application No. 10-2008-7014435.
Japanese Official Action issued Nov. 9, 2010, in JP Application No. 2006-528562.

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