Prepreg for printed circuit board

Details Prepreg for printed circuit board Prepreg for printed circuit board

1996-09-13

1999-10-12

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4282974, 428332, 428338, 428339, 428418, 428901, 4283211, 428384, 174258, B32B 900

Patent

active

059652454

ABSTRACT:
A prepreg comprising a semi-cured thermosetting resin and electrically insulating whiskers or short fibers dispersed in said semi-cured thermosetting resin, and if necessary, a carrier film attached or bound to said prepreg is suitable for producing multilayer printed circuit boards of reduced thinness, high wiring density and high connection reliability with high productivity and low production cost.

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