Prepreg and conductive layer-laminated substrate for printed...

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S258000, C174S259000, C428S297400, C428S901000

Reexamination Certificate

active

07820274

ABSTRACT:
A prepreg having low dielectric constant, low dielectric loss, and high heat cycle resistance. The prepreg includes a sheet-like preform and a resin-impregnated, sheet-like, fiber-reinforced material thermal pressure adhered to the sheet-like preform. The sheet-like preform includes a graft copolymer (a) in which 15 to 40 parts by mass of an aromatic vinyl monomer are grafted to 60 to 85 parts by mass of a random or block copolymer comprising monomer units selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers. The resin-impregnated, sheet-like, fiber-reinforced material includes a sheet-like, fiber-reinforced material (b1) and a thermoplastic resin (b2) into which the sheet-like, fiber-reinforced material (b1) is impregnated. The thermoplastic resin (b2) is a random or block copolymer composed of 60 to 90 mass % of a monomer unit, which is selected from nonpolar α-olefin monomers and nonpolar conjugated diene monomers, and 10 to 40 mass % of an aromatic vinyl monomer unit.

REFERENCES:
patent: 2805181 (1957-09-01), Groff et al.
patent: 3238077 (1966-03-01), Clark et al.
patent: 3240662 (1966-03-01), Smyers et al.
patent: 6420476 (2002-07-01), Yamada et al.
patent: 6500535 (2002-12-01), Yamada et al.
patent: 9-23047 (1997-01-01), None
patent: 10-265592 (1998-10-01), None
patent: 11-87910 (1999-03-01), None
patent: 97/38564 (1997-10-01), None
patent: 99/10435 (1999-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Prepreg and conductive layer-laminated substrate for printed... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Prepreg and conductive layer-laminated substrate for printed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Prepreg and conductive layer-laminated substrate for printed... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4241588

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.