Prepreg and circuit board and method for manufacturing the same

Details Prepreg and circuit board and method for manufacturing the same Prepreg and circuit board and method for manufacturing the same

2006-05-16

2006-05-16

Dixon, Merrick (Department: 1774)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C427S097100, C427S098200, C427S098800, C257S750000, C257S774000, C257S798000, C361S749000

Reexamination Certificate

active

07045198

ABSTRACT:
The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of an insulating layer. The present invention also provides a method for manufacturing the prepreg and the circuit board. The prepreg of the present invention includes a laminate including at least one first layer and at least one second layer. The first layer is an insulating layer that includes a resin. The second layer has pores that connect an upper and a lower surface of the second layer, and the upper and the lower surface of the second layer differ from each other in at least one selected from open are ratio and average pore diameter. Using this prepreg makes it possible to provide a circuit board that is characterized, e.g., by low interstitial via connection resistance, excellent connection stability, and high durability.

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