Preplating of semiconductor small outline no-lead leadframes

Details Preplating of semiconductor small outline no-lead leadframes Preplating of semiconductor small outline no-lead leadframes

2005-01-04

2005-01-04

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

C257S666000

Reexamination Certificate

active

06838757

ABSTRACT:
For a leadframe for use with integrated circuit chips, a continuous strip of sheet-like base metal is pre-plated with a layer of nickel fully covering the base metal, further on one surface with a palladium layer in a thickness suitable for bonding wire attachment, and on the opposite surface with a layer of either palladium or lead-free solder in a thickness suitable for parts attachment. The leadframe structure is then stamped from the sheet so that the base metal is exposed at the stamped edges, enhancing adhesion to molding compounds.

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patent: 5635755 (1997-06-01), Kinghorn
patent: 5767574 (1998-06-01), Kim et al.
patent: 5885891 (1999-03-01), Miyata et al.
patent: 5914532 (1999-06-01), Akagi et al.
patent: 5977620 (1999-11-01), Kim et al.
patent: 0 250 146 (1987-12-01), None

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