Preparing particleboard utilizing a vegetable wax or derivative

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156296, 1563314, 106271, B32B 2102, C08L 9106

Patent

active

043881386

ABSTRACT:
Sheets or moulded bodies, for example particle board, are manufactured by hot pressing a lignocellulosic material in contact with an organic polyisocyanate and a wax release agent which is a vegetable wax, a modified vegetable oil, a microcrystalline wax or a mineral wax, said wax release agent having a melting point of at least 70.degree. C. Preferably the wax release agent is applied to the lignocellulosic material in the form of a dispersion in an aqueous emulsion of the polyisocyanate. The process facilitates the release of the sheets or moulded bodies from the caul plates or platens of the press.

REFERENCES:
patent: 2094771 (1937-10-01), Charch et al.
patent: 2177240 (1939-10-01), Brumbaugh
patent: 2206090 (1940-07-01), Haggenmacher
patent: 3374100 (1968-03-01), Goldstein et al.
patent: 3677808 (1972-07-01), Sheridan
patent: 3880975 (1975-04-01), Lundmark
patent: 3930110 (1975-12-01), Shoemaker
patent: 4209433 (1980-06-01), Hse
patent: 4241133 (1980-12-01), Lund et al.
patent: 4279788 (1981-07-01), Lambuth
Maloney, Modern Particleboard & Dry-Process Fiberboard Manufacturing.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Preparing particleboard utilizing a vegetable wax or derivative does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Preparing particleboard utilizing a vegetable wax or derivative , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Preparing particleboard utilizing a vegetable wax or derivative will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-162387

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.