Preparing heat resistant heat shrinkable films

Details Preparing heat resistant heat shrinkable films Preparing heat resistant heat shrinkable films

1983-11-10

1985-09-17

Thurlow, Jeffery

Plastic and nonmetallic article shaping or treating: processes

Direct application of fluid pressure differential to...

Producing multilayer work or article

264567, 264173, 428518, B29D 724

Patent

active

045419833

ABSTRACT:
A three layer heat shrinkable film is disclosed, along with preferred process for making it. The film comprises a first heat sealable layer of an ionomer, a second layer of a vinylidene chloride copolymer, and a third layer of a blend of an ionomer and an EVA copolymer. The EVA content is no greater than 20% of the blend by weight, and the vinyl acetate content is at least 4.5% of the blend by weight. In the preferred process, a three layer tape is coextruded and cooled, and reheated to 197.degree.-203.degree. F., and oriented in a conventional double bubble process.

REFERENCES:
patent: 3707590 (1972-12-01), Wiggins et al.
patent: 3819792 (1974-06-01), Ono et al.
patent: 3853661 (1974-12-01), Sudo
patent: 3856448 (1974-12-01), Iijima et al.
patent: 3962396 (1976-06-01), Ono et al.
patent: 4098406 (1978-07-01), Otten et al.
patent: 4161562 (1979-07-01), Yoshikawa et al.
patent: 4183882 (1980-01-01), Weinberg et al.
patent: 4226822 (1980-10-01), Yoshikawa et al.
patent: 4247584 (1981-01-01), Widiger et al.

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