Preparation of surfaces for solder joining

Details Preparation of surfaces for solder joining Preparation of surfaces for solder joining

1993-05-20

1995-03-21

Ramsey, Kenneth J.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228223, 228260, B23K 35363

Patent

active

053988655

ABSTRACT:
An apparatus and process prepares surfaces on components, boards and the like for assembly and solder joining. Oxides and other coatings can be removed from surfaces to be soldered without having to solder coat surfaces prior to joining. A polymer and an activator combination is applied to the surfaces, the polymer being thermally de-polymerizable and the combination removing oxides from the surfaces. The surfaces are heated after application of the polymer and activator to de-polymerize the polymer. Solder is then applied to solder join the surfaces.

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patent: 4963401 (1990-10-01), Kaspaul
patent: 5045128 (1991-09-01), Landreth et al.
patent: 5090651 (1992-02-01), Mittag
patent: 5104494 (1992-04-01), Tench et al.
patent: 5121875 (1992-06-01), Hagerty et al.
patent: 5240169 (1993-08-01), Gileta
Frear et al., Fluxless Soldering Using Actuated Acid Vapors, pp. 1704-1715.
Bakszt M., Providing Solderability Retention By Means of Chemical Inhibitors, Printed Circuit World, pp. 2-8, Convention III.
Dry Soldering Process Using Halogenated Gas, IBM Technical Disclosure Bulletin, vol. 27, No. II, Apr. 1985, p. 6513.
Goldman et al., Proprietary Treatments for Copper Pads, PC FAB, Oct. 1990, pp. 60-66.

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