Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1988-06-01
1989-07-11
Silverman, Stanley
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 97, 427 98, 427306, B05D 512
Patent
active
048471143
ABSTRACT:
The method for the manufacture of printed circuit boards which have been imaged by means of a polymeric resist which comprises selectively catalyzing those areas not covered by the image by treating the imaged circuit board with a catalyst having a charge higher than the charge on the non-imaged areas and sufficiently lower than the charge on the resist image to cause the catalyst to be repelled therefrom, but sufficiently close to the charge on the non-imaged areas to cause adsorption of the catalysts thereon.
REFERENCES:
patent: 2690402 (1954-09-01), Crehan
patent: 2927022 (1960-03-01), Martin et al.
patent: 3469982 (1969-09-01), Celeste
patent: 3532518 (1979-10-01), D'Ottavio
patent: 3562038 (1971-02-01), Shipley
patent: 3632435 (1972-01-01), Segeltorp
patent: 3799816 (1974-03-01), Schneble, Jr. et al.
patent: 3871885 (1975-03-01), Hertler
patent: 3958048 (1976-05-01), Donavan et al.
patent: 3993799 (1976-11-01), Feldstein
patent: 4073981 (1978-02-01), Baron
patent: 4087586 (1978-05-01), Feldstein
patent: 4089686 (1978-05-01), Townsend
patent: 4100037 (1978-06-01), Baron et al.
patent: 4136216 (1979-01-01), Feldstein
patent: 4199623 (1980-04-01), Nuzzi et al.
patent: 4220678 (1980-09-01), Feldstein
patent: 4233344 (1986-11-01), Brasch
patent: 4259113 (1981-03-01), Nuzzi et al.
patent: 4305975 (1981-12-01), Ikari et al.
patent: 4478883 (1984-10-01), Bupp
patent: 4537799 (1985-08-01), Dorey, II et al.
patent: 4610910 (1986-09-01), Kamamoto
patent: 4634619 (1987-01-01), Lindsay
McFayden & Matijevic, Journal of Colloid and Interface Science, vol. 44, No. 1, Jul. 1975, pp. 95-106.
Weiser, Inorganic Colloid Chemistry, vol. I, John Wiley & Sons, Inc., 1933, pp. 137-138.
Encyclopedia of Chemical Technology, Kirk-Othman, 3rd Edition, vol 17, pp. 680-708 (1982).
Brasch William R.
Favini Carlo
Lea-Ronal, Inc.
Silverman Stanley
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