Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2005-02-22
2005-02-22
Dawson, Robert (Department: 1712)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C525S390000, C525S391000, C525S392000, C525S386000, C525S331200, C525S331200, C526S335000, C526S336000, C526S340000, C526S346000, C526S347100, C528S205000
Reexamination Certificate
active
06858304
ABSTRACT:
Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula ofare provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature (“Tg”), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.
REFERENCES:
patent: 3288864 (1966-11-01), Farnham
patent: 4175175 (1979-11-01), Johnson et al.
patent: 4307223 (1981-12-01), Shintani et al.
patent: 4334106 (1982-06-01), Dai
patent: 4988785 (1991-01-01), Paul et al.
patent: 5145926 (1992-09-01), Patel et al.
J.C. Wilson, “Polyamides and Polyesters Derived From 1.1.3-Trimethyl-3-(P-Aminophenyl) . . . ” dated Jan. 1975 pp. 749-754.
McCarthy Thomas F.
Schwind David
Smith Gordon
Bingham & McCutchen LLP
Dawson Robert
Honeywell International , Inc.
Thompson Sandra P.
Zimmer Marc S
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