Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate
2008-04-30
2010-06-01
Pyon, Harold Y (Department: 1796)
Semiconductor device manufacturing: process
Chemical etching
Liquid phase etching
C438S753000, C438S754000, C252S500000, C029S825000, C029S829000, C424S401000
Reexamination Certificate
active
07727901
ABSTRACT:
A method of forming an ink, the ink configured to form a conductive densified film is disclosed. The method includes providing a set of Group IV semiconductor particles, wherein each Group IV semiconductor particle of the set of Group IV semiconductor particles includes a particle surface with a first exposed particle surface area. The method also includes reacting the set of Group IV semiconductor particles to a set of bulky capping agent molecules resulting in a second exposed particle surface area, wherein the second exposed particle surface area is less than the first exposed particle surface area. The method further includes dispersing the set of Group IV semiconductor particles in a vehicle, wherein the ink is formed.
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Jayaraman Manikandan
Rogojina Elena V.
Vanheusden Karel
Chiang Timothy
Foley & Lardner LLP
Innovalight, Inc.
Pyon Harold Y
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