Preparation of a firm bond between copper layers and aluminum ox

Details Preparation of a firm bond between copper layers and aluminum ox Preparation of a firm bond between copper layers and aluminum ox

1992-09-11

1994-05-03

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

C23C 1434

Patent

active

053084632

ABSTRACT:
A process for preparing a firm bond between copper layers and aluminum oxide ceramic without coupling agent layers wherein the aluminum oxide ceramic is subjected to a plasma etching process in a first vacuum chamber in the presence of oxygen and immediately thereafter plated with copper by sputtering in a second vacuum chamber.

REFERENCES:
patent: 4964962 (1990-10-01), Nobutani et al.
Patent Abstracts of Japan, vol. 12, No. 372 (C-533), Oct. 5, 1988, No. 63-121651(A).
Patent Abstracts of Japan, vol. 13, No. 63 (C-568), Feb. 13, 1989, No. 63-255360(A).

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