Preforms for molding processes

Details Preforms for molding processes Preforms for molding processes

1991-01-25

1991-12-10

Woo, Jay H.

Stock material or miscellaneous articles

Article of intermediate shape

428 74, 428114, 428236, 428237, 428239, 428240, 428245, 428246, 428260, 428261, 428262, 428268, 428281, 428282, 428283, 428284, 428286, 428287, 428290, 428327, 428339, 428224, 264135, 264137, 264324, D04H 158, D04H 160, B29C 4320

Patent

active

050717111

ABSTRACT:
Preforms for molding processes such as resin transfer molding processes are prepared by melting a solid, non-sintering, thermoplastic-like resinous compound on the surface of a substrate material. After cooling, assembling one or more plies of the coated substrate material into the desired shape; heating the shaped substrate material to a temperature above the melting temperature of the resinous compound and subsequently cooling to a temperature below the melting point of the resinous compound.

REFERENCES:
patent: 3922418 (1975-11-01), Lauchenauer
patent: 4213930 (1980-07-01), Goodrich et al.
patent: 4325770 (1982-04-01), Korpman
patent: 4329387 (1982-05-01), Goodrich et al.
patent: 4496415 (1985-01-01), Sprengling

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