Preforming of preheated plastic pellets for use in transfer mold

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article

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264 26, 26427214, 26427215, 26427217, 2643285, 26432817, 264322, 264325, B29C 4514

Patent

active

045698147

ABSTRACT:
Prior to supplying plastic encapsulant to the reservoir of a mold for the purpose of encapsulating semiconductor devices, pellets of the encapsulant are heated until they become soft. An operator then places the pellets into a preforming chamber where they are compressed to form a softened charge of encapsulant. This charge is then removed from the chamber and placed into the reservoir of the mold.

REFERENCES:
patent: 3473196 (1969-10-01), Hull et al.
patent: 4374795 (1983-02-01), Keilp et al.
patent: 4480975 (1984-11-01), Plummer et al.

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