Preformed sensor housings and methods to produce thin metal...

Measuring and testing – Fluid pressure gauge – Mounting and connection

Reexamination Certificate

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C073S756000, C361S283400

Reexamination Certificate

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11552064

ABSTRACT:
A preformed sensor housing including a conduit having an inside; a plug disposed within the conduit; and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.

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Office Action dated Oct. 30, 2007, issued in corresponding U.S. Appl. No. 11/332,754.
Kurtz et al., “Ultra High Temperature, Miniature, SOI Sensors for Extreme Environments”, Kulite Semiconductor Products, Inc., presented at the IMAPS International HiTEC 2004 Conference; Santa Fe, New Mexico, May 17-20, 2004.

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