Preformed planar structures for semiconductor device assemblies

Details Preformed planar structures for semiconductor device assemblies Preformed planar structures for semiconductor device assemblies

1995-04-25

1996-10-29

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257779, 257780, H01L 2348, H01L 2944

Patent

active

055699634

ABSTRACT:
A semiconductor die having raised conductive bumps on its surface for connecting to other devices or systems is disposed on a face of a preformed planar structure (interposer) having through holes. Solder joints with conductive bumps on an underlying substrate are formed in the through holes. In one embodiment, the interposer is dissolvable. In another embodiment, the through holes are at least partially filled with a conductive material for electrically connecting to the die. In another embodiment, the through holes are angled so that the interposer acts as a pitch spreader or adapter. In another embodiment, ball bumps are disposed on a side of the interposer away from the die. Various other embodiments are directed to multi-tier flip-chip arrays employing preformed planar structures between tiers.

REFERENCES:
patent: 5347162 (1994-09-01), Pasch

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