Prefabricated and attached interconnect structure

Details Prefabricated and attached interconnect structure Prefabricated and attached interconnect structure

2007-02-06

2007-02-06

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C029S825000, C324S754090

Reexamination Certificate

active

10964316

ABSTRACT:
A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.

REFERENCES:
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5173055 (1992-12-01), Grabbe
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5223741 (1993-06-01), Bechtel et al.
patent: 5604330 (1997-02-01), Hasan et al.
patent: 5644249 (1997-07-01), Kister
patent: 5672548 (1997-09-01), Culnane et al.
patent: 5900738 (1999-05-01), Khandros et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5923090 (1999-07-01), Fallon et al.
patent: 5934914 (1999-08-01), Fjelstad et al.
patent: 5994152 (1999-11-01), Khandros et al.
patent: 6023103 (2000-02-01), Chang et al.
patent: 6029344 (2000-02-01), Khandros et al.
patent: 6049976 (2000-04-01), Khandros
patent: 6050829 (2000-04-01), Eldridge et al.
patent: 6124546 (2000-09-01), Hayward et al.
patent: 6168974 (2001-01-01), Chang et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6184587 (2001-02-01), Khandros et al.
patent: 6215196 (2001-04-01), Eldridge et al.
patent: 6215670 (2001-04-01), Khandros
patent: 6232149 (2001-05-01), Dozier, II et al.
patent: 6242803 (2001-06-01), Khandros et al.
patent: 6268015 (2001-07-01), Mathieu et al.
patent: 6330164 (2001-12-01), Khandros et al.
patent: 6354868 (2002-03-01), Korczynski et al.
patent: 6420887 (2002-07-01), Kister et al.
patent: 6441315 (2002-08-01), Eldridge et al.
patent: 6475822 (2002-11-01), Eldridge et al.
patent: 6476333 (2002-11-01), Khandros et al.
patent: 6482013 (2002-11-01), Eldridge et al.
patent: 6483328 (2002-11-01), Eldridge et al.
patent: 6491968 (2002-12-01), Mathieu et al.
patent: 6497581 (2002-12-01), Slocum et al.
patent: 6520778 (2003-02-01), Eldridge et al.
patent: 6532654 (2003-03-01), Guerin et al.
patent: 6538214 (2003-03-01), Khandros
patent: 6539531 (2003-03-01), Miller et al.
patent: 6669489 (2003-12-01), Dozier et al.
patent: 2001/0002341 (2001-05-01), Eldridge et al.
patent: 2001/0038030 (2001-11-01), Khandros et al.
patent: 2002/0117330 (2002-08-01), Eldridge et al.
patent: 2002/0145032 (2002-10-01), Khandros et al.
patent: 2003/0010976 (2003-01-01), Grube et al.
patent: 2003/0015347 (2003-01-01), Eldridge et al.
patent: 2003/0057975 (2003-03-01), Eslamy et al.
patent: 2003/0062398 (2003-04-01), Khandros

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