Data processing: measuring – calibrating – or testing – Measurement system – Performance or efficiency evaluation
Reexamination Certificate
2007-08-28
2007-08-28
Bui, Bryan (Department: 2863)
Data processing: measuring, calibrating, or testing
Measurement system
Performance or efficiency evaluation
C702S183000
Reexamination Certificate
active
10841570
ABSTRACT:
Data used for prediction is selected based on multivariate analysis, and thereby, prediction accuracy is improved. Operation data obtained every wafer processing and processing result data such as thickness of top electrode are stored (collected) in operation data storage sections202and a processing result data storage sections and204,respectively. An analysis processing section208makes multivariate analysis with respect to the collected operation data, and thereafter, data used for prediction is selected based on the multivariate analysis. A correlation between the selected operation data and processing result data is found. Based on the correlation, a condition of the plasma processing apparatus or state of an object to be processed as the processing result using operation data when processing wafers other than wafers used for obtaining the correlation.
REFERENCES:
patent: 2004/0007560 (2004-01-01), Sakano et al.
patent: 2004/0181299 (2004-09-01), Yamazaki et al.
patent: 2004/0254761 (2004-12-01), Sakano et al.
Journal of Chemometrics, vol. 2, pp. 211-228 (1988).
Bui Bryan
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Tokyo Electron Limited
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