Predicting process excursions based upon tool state variables

Details Predicting process excursions based upon tool state variables Predicting process excursions based upon tool state variables

2005-06-14

2005-06-14

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

With measuring or testing

Optical characteristic sensed

C438S007000, C700S121000, C700S108000

Reexamination Certificate

active

06905895

ABSTRACT:
A method and an apparatus for predicting excursions based upon tool state variables. At least one semiconductor wafer is processed in a processing tool. Tool state data relating to the processing tool is acquired. The tool state data comprises at least one tool state variable. A determination is made whether an excursion of the tool health related to the processing tool has occurred based upon the tool state data. The tool state variable is modified to reduce the excursion of the tool health in response to the determination that the excursion of the tool health has occurred.

REFERENCES:
International Sematech “Advanced Process Control Framework Initiative (APCFI) Project Overview” Tech Transfer #99053735A-TR also at <<http://www.sematech.org/docubase/document/3735atr.pdf>> Jun. 30, 1999.

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