Predeposited transient phase electronic interconnect media

Details Predeposited transient phase electronic interconnect media Predeposited transient phase electronic interconnect media

1997-06-09

1999-10-12

Ryan, Patrick

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

22818021, 228254, 228261, B23K 3102, B23K 3512

Patent

active

059643951

ABSTRACT:
A method of attaching an electronic component to a substrate comprising the steps of depositing a spray metal coating atop a substrate. An electronic component is placed atop a coating. A liquid metal is dispensed on or near the component. The liquid metal wets the component and the coating. The metal is reacted with the coating to form an electrically conductive bond with the substrate and adheres the component to the substrate. The reactive metal may be heated to a temperature which makes it liquid and facilitates wetting the coating and component. Suitable materials for the spray metal coating include copper, nickel, tin, bismuth, lead and silver and mixtures thereof. Suitable liquid metals generally include low melting temperature metals such as gallium and indium and mixtures thereof.

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patent: 5170930 (1992-12-01), Dolbear et al.
patent: 5320272 (1994-06-01), Melton et al.
patent: 5340015 (1994-08-01), Hira et al.
patent: 5381945 (1995-01-01), Leicht
patent: 5597110 (1997-01-01), Melton et al.

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